BTQ Technologies and ICTK Complete Design of Next-Generation QCIM-PUF Security Chip
BTQ Technologies and ICTK have completed the design of their next-generation QCIM-PUF security chip. This achievement combines BTQ’s QCIM cryptographic accelerator with ICTK’s VIA PUF technology to enable hardware-rooted device authentication and post-quantum cryptographic agility. The platform targets IoT, AI devices, industrial systems, and connected infrastructure requiring long-term security resilience. Backed by a €13.9 million development agreement, test chips are set to ship to customers by year-end. This positions BTQ strongly in Korea’s quantum security market and supports global commercialization of quantum-secure solutions.
July 11, 2026